Papan Sirkuit PCB kaku
| Pesanan Qty. | Produksi massal | Produksi sampel | |
| Jumlah lapisan | 2~ 32L | 48L | |
| Maks.Ketebalan PCB | 12mm (472mil) | 12mm (472mil) | |
| Min.Jembar / Spasi | Lapisan njero | 2,5mil / 2,5mil | 2.2mil/2.2mil |
| Lapisan njaba | 3jt/3jt | 2,8mil / 2,8mil | |
| Maks.Ketebalan Tembaga | 6 oz | 30 Oz | |
| Min.Diameter Lubang Pengeboran | Lubang mekanik | 0,15 mm (6 mil) | 0,1 mm (4 mil) |
| bolongan laser | 0,1 mm (4 mil) | 0,075 mm (3 mil) | |
| Maks.Ukuran (Finish Size) | Lapisan siji lan kaping pindho | 1150mmX500mm | 1250mmX550mm |
| Multilayer | / | 1250mmX570mm | |
| Rasio Aspek (Bolongan Rampung) | 10:01:00 | 16:01:00 | |
| Bahan | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| Frekuensi Dhuwur | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| liyane | basis Alu., basis Cu etc. | ||
| Lumahing Rampung | HASL, ENIG, Immersion Tin, OSP, Immersion Silver,Electroplating Emas Keras/Emas Lembut, Jari Emas, Pilihan OSP, ENEPIG. | ||
| Tembaga abot PCB | Maks.Ketebalan Tembaga | 6 oz | 30 Oz |
| HDI PCB Kab | Struktur | Sembarang Lapisan (10L) | Sembarang Lapisan (10L) |
| Jembar/Ruang (Lapisan Luar) | 2,5mil / 2,5mil | 2mil/2mil | |
| Rasio Aspek (Blind Hole) | 1:01:00 | 1:01:00 | |